Winner PMW-1550-80-6.5/165 is a high-performance panda-type polarization-maintaining fiber designed for demanding applications at 1550 nm, including coherent optical communications, fiber lasers, and miniaturized polarization-sensitive sensors.
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Engineered for the C-band, this fiber features a germanosilicate core surrounded by dual boron-doped stress-applying parts (SAPs) that induce strong linear birefringence, ensuring stable polarization propagation with crosstalk of ≤ -30 dB over 2 meters. Its ultra-low attenuation (≤0.6 dB/km) and precise mode field diameter (6.5 ±0.5 μm) make it ideal for low-loss coupling to DFB lasers, modulators, and integrated photonic circuits.
The fiber employs a reduced 165 μm dual-layer acrylate coating—significantly thinner than standard 245 μm fibers—enabling higher packing density in compact modules such as polarization-maintaining couplers, interferometers, and aerospace-grade sensor coils. Despite its slim profile, it maintains ≥100 kpsi proof tension screening and excellent bending resilience, supporting reliable device packaging and long-term field operation.
| Brand Name | Winner |
| Model Number | PMW-1550-80-6.5/165 |
| Fiber Type | Panda-Type Polarization-Maintaining Single-Mode Fiber |
| Operating Wavelength | 1550 nm |
| Attenuation | ≤0.6 dB/km @1550 nm |
| Mode Field Diameter | 6.5 ± 0.5 μm @1550 nm |
| Cut-off Wavelength | 1400–1520 nm |
| Cladding Diameter | 125 ± 1 μm |
| Coating Diameter | 165 ± 5 μm |
| Polarization Crosstalk | ≤ -30 dB per 2 meters @1550 nm |
| Bow (Shoot Length) | ≤ 4.0 mm per meter |
| Tension Screening Level | ≥100 kpsi |
| Key Performance | Excellent geometric uniformity for consistent splicing yield Superior tapering and grinding compatibility High polarization extinction ratio (PER) in packaged devices Stable performance under thermal cycling (-40°C to +85°C) |
For optimal PER, align the slow axis (marked by SAP orientation) using a rotational fusion splicer. Avoid bend radii below 10 mm to prevent excess loss or birefringence distortion. The thin 165 μm coating reduces module footprint but requires careful stripping with precision tools to avoid core damage.
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